Ranovus, IBM, TE Connectivity, and Senko Advanced Components are planning to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data centers. Senko's fibre optic connectivity solutions for optical coupling, on-board/mid-board, and faceplate support 100Gbps/lane and beyond Co-Packaged Optics equipment designs. These include low profile and precision Fiber coupler assemblies, micro sized on-/mid-board connectors, reflow compatible connector assemblies, and space saving connector options for faceplate. These will provide more efficiency, scalability, and flexibility in designs for Co-Packaged Optics equipment.
Read more on Electronics Weekly (UK).